Description
■ Features
・For different manufacturing processes, different tape stickers, vacuum lamination machines or cleaning machines can be installed.
・The lamination process can be performed according to different wafer frames.
・The camera positioning module is adopted, which can correspond to various wafer positioning methods such as V-shaped cutout and center of gravity positioning.
・A high-precision ceramic carrier can be used to realize tape transfer and frame change after wafer cutting or wafer expansion.
・Low temperature LED UV debonding module can restrain the tension and deformation of the tape after debonding.
■ Specification
・Device size: 3500mm(D) x 2500mm(W) x 1910mm(H) ・Wafer size: 8 inch , 12 inch
・Frame size: 12 inch , 8 inch
