Service items
Wafer Packaging, Flip Chip,Laminator, Automatic Transfer Molder, Placement Machine, Laser Drilling Machine, Automated Machinery Development
babyiceinternational Advantage
Customized
客製化開發
Quality Control
品質嚴管
After-sales service
售後服務
Product introduction
About us
Babyice International CO., LTD. was founded in 2015. Our founders come from leading foundry, OSAT, and equipment manufacturer. Our team have solid experience in advanced packaging technologies such as 2D wafer-level packaging (WLP), 2.5D interposer/Si bridge, 3D die-stacking, flip-chip, system-in-package (SiP), and advanced substrate technologies for more than 15 years.
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Babyice International CO., LTD.
SEMI,#SMT,#LED #wafer-level packaging, #WLP, #2.5D interposer, #Si bridge, #3D PoP, #flip-chip, #system-in-package, #SiP#Mounter, #Re-mount, , #Laminator, #Underfill, #Laser drill, #Laser marking, #Heat sink, #Ball mount, #Photoresist, # PR , # PI, #Temporary bonding, #Release layer, #Adhesive layer;
contact us
If you have any questions, please contact us
- Phone +1 (948) 209-0898
- mancyhuang@babyice.com.tw
- 11F.-2, No. 65, Songde Rd., Xinyi Dist., Taipei City , Taiwan (R.O.C.)
