Description
■ Features
Semi-automatic Laminator (available for 8″ and 12″ wafers)
With wafer carrier dicing or single wafer dicing, roll film or pre-cut (customized)
Ceramic platform vacuum limit to 100pa
It can be reworked when the film is damaged in the thin wafer filming and post-filming process (it can also be reworked when the film is damaged after dicing)
The newly designed stage can be applied to various heights of the wafer carrier frame to realize the flip-up film.
Manual film tearing with stencils or optional P230 M automatic film tearing platform for film tearing .
