Babyice International CO., LTD. was founded in 2015. Our founders come from leading foundry, OSAT, and equipment manufacturer. Our team have solid experience in advanced packaging technologies such as 2D wafer-level packaging (WLP), 2.5D interposer/Si bridge, 3D die-stacking, flip-chip, system-in-package (SiP), and advanced substrate technologies for more than 15 years.

Babyice has independent research and development of patent products/technologies in advanced packaging. In addition to independent research and development of products, the company acts as an agent of world-class brands, adopting a two-way strategy to provide better services to customers.