Description
Specification
This equipment is used for automatic gluing and ball mounting of products on semiconductor boats. The Boat is pushed out of the Magazine, and sent to the runner after being detected by AOI for material shortage. The arm is used for gluing and ball placement in sequence, and then AOI is used to detect whether the solder balls on the Boat are defective. If there is any defect, it will be sent to the Reject area; if there is no defect, it will be sent to the runner to the next process.
Features
- Dual-track dual-ARM division of labor to improve work efficiency
- Automatic ball placement and ball missing detection functions
- Automatically point Flux & clear glue function
- 2D Barcode reading and throwing function
- High mold compatibility, single-row mold, half-mold, full-mold switchable mode operation